Compute without Constraints

Advanced phase-change thermal interface materials engineered for next-generation 3D packaging and high-TDP silicon architectures.

We remove thermal bottlenecks so you can optimize for performance

The Efficiency Revolution

Cooling is the bottleneck of the AI revolution.

Chips and racks are designed AROUND thermal limitations – rather than optimizing for performance.

Our technology decouples thermal constraints from compute power – unlocking a new paradigm in chip design and datacenter architecture.

By eliminating traditional Z-height thermal bottlenecks, architects can aggressively stack logic on memory, shorten interconnect paths, and optimize floorplans based on latency rather than thermal dissipation limits.

Efficiency =
Tokens Watt × Second

Increase compute efficiency 10x or more
without changing chip design

Seamless Integration

  • Keep your architecture, drop the thermals: Eliminate thermal bottlenecks without forcing a redesign of your existing silicon blueprints.
  • Drop-in compatibility: Engineered to integrate seamlessly with advanced packaging standards.
  • Immediate thermal relief: Provide the localized cooling to next-gen high-TDP processor demand, right where it’s needed most.

Economics

  • Unlocking 3D packaging density: Enable dense multi-die architectures by removing the structural thermal barriers of high-TDP silicon.
  • Slashed total cost of ownership (TCO): Drastically reduce datacenter real estate and infrastructure footprints with ultra-high compute density.
  • Uncompromising power efficiency: Lower facility-level energy overhead while maintaining absolute reliability for mission-critical workloads.

True Sustainability

  • Eco-friendly by design: Utilizing non-toxic, environmentally stable phase-change materials that protect both your hardware and the planet.
  • Zero-compromise green infrastructure: Meet aggressive corporate sustainability targets without sacrificial hits to compute throughput.

Team & Mission

Paul West, PhD

Founder, CEO

11+ years in Bay-Area Tech (Intel, Apple)
2x Founder
Computational architect

Paul Klemencic

Founder, Chief Development Officer

20+ years in energy & Thermal management
Founder and CTO of Skibo, GreenRock & CHESS Energy
Deep-tech specialist in TQM methodology

Join the Revolution

We are actively building our core engineering and investment team to fundamentally change how the world designs high-density compute.

We are currently seeking:

Stay in touch for news, updates, and opportunities.